JPH0325247U - - Google Patents

Info

Publication number
JPH0325247U
JPH0325247U JP1989085776U JP8577689U JPH0325247U JP H0325247 U JPH0325247 U JP H0325247U JP 1989085776 U JP1989085776 U JP 1989085776U JP 8577689 U JP8577689 U JP 8577689U JP H0325247 U JPH0325247 U JP H0325247U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation fin
semiconductor device
ceramic
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989085776U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989085776U priority Critical patent/JPH0325247U/ja
Publication of JPH0325247U publication Critical patent/JPH0325247U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1989085776U 1989-07-20 1989-07-20 Pending JPH0325247U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989085776U JPH0325247U (en]) 1989-07-20 1989-07-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989085776U JPH0325247U (en]) 1989-07-20 1989-07-20

Publications (1)

Publication Number Publication Date
JPH0325247U true JPH0325247U (en]) 1991-03-15

Family

ID=31635076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989085776U Pending JPH0325247U (en]) 1989-07-20 1989-07-20

Country Status (1)

Country Link
JP (1) JPH0325247U (en])

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